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RBM Infracon Limited has entered into a Memorandum of Understanding (MOU) with SUJOK GLOBAL Private Limited. This strategic partnership represents a formal collaboration between the two entities, though specific financial details and execution timelines were not disclosed in the announcement.
RBM Infracon signed a binding LOI with Korea's SUJOK GLOBAL for a ₹9,200 Crore (USD 1 billion) semiconductor packaging facility in India. RBM will hold a 30% equity stake with significant governance rights. The project targets high-growth sectors like AI and HBM, aligning with the India Semiconductor Mission.